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This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.
Product Details
- Published:
- 06/01/2013
- Number of Pages:
- 132
- File Size:
- 1 file , 6.3 MB