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This new standard addresses semiconductor flip chip design requirements. Provides information intended for applications utilizing standard semiconductor substrates, materials, assembly and test methods commensurate with established fabrication, bumping, test and handling practices. Covered in the standard are electrical, thermal and mechanical chip design parameters and methodologies, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs
Product Details
- Published:
- 04/01/1999
- Number of Pages:
- 48
- File Size:
- 1 file , 500 KB
- Product Code(s):
- J-026(D)1