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This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. This standard also includes a test method for the resistance to dissolution/dewetting of metallization. This standard is intended for use by both supplier and user.
Product Details
- Published:
- 11/01/2017
- Number of Pages:
- 68
- File Size:
- 1 file , 2.2 MB