Click here to purchase
Specifies the general requirements of enamelled round copper winding wires with or without bonding layer. This publication supersedes IEC 60182-1 (1984) and IEC 60182-2 (1987).
Product Details
- Edition:
- 2.1
- Published:
- 01/14/2000
- Number of Pages:
- 53
- File Size:
- 1 file , 170 KB