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IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Product Details
- Edition:
- 1.0
- Published:
- 12/11/2012
- Number of Pages:
- 34
- File Size:
- 1 file , 380 KB