This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.
Product Details
- Published:
- 01/01/2023
- ISBN(s):
- 9781638161134
- Number of Pages:
- 104
- File Size:
- 1 file , 7.8 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus