Category: IPC

Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 09/01/2020

Sectional Design Standard for Rigid Organic Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2010

Requirements for Printed Electronics Functional Conductive Materials
standard by Association Connecting Electronics Industries, 01/01/2018

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009

Metal Foil for Printed Board Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2016

Design and Assembly Process Implementation for Flip Chip and Die-Size Components
standard by Association Connecting Electronics Industries, 01/01/2018

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/24/2020

Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2013

Troubleshooting for Printed Board Assembly Processes
standard by Association Connecting Electronics Industries, 01/01/2019

Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009

Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/1998

Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
standard by Association Connecting Electronics Industries, 06/01/2002