Category: IPC

Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009

Automated Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/1988

Generic Requirements for Surface Mount Land Pattern and Design Standard – INCLUDES LAND PATTERN VIEWER SOFTWARE
standard by Association Connecting Electronics Industries, 02/01/2007

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 12/01/2016

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

Standard for Determining Current Carrying Capacity in Printed Board Design
standard by Association Connecting Electronics Industries, 08/01/2009

Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000

Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007

Printed Wiring Board Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 06/01/2005

Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988

Requirements & Acceptance for Cable & Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 01/01/2002

Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008