Category: IPC

Specification for Immersion Tin Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2007

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
standard by Association Connecting Electronics Industries, 11/01/2013

Guidelines for Phototool Generation and Measurement Techniques
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/1991

Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,

Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison)
Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/2002

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010

Analysis of the Market for Rigid Printed Wiring Boards and Related Materials for 1999
Report / Survey by Association Connecting Electronics Industries, 06/27/2000

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010

Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006