Category: IPC

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 04/01/2016

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012

Supply Chain Social Responsibility Management System Guidance
standard by Association Connecting Electronics Industries, 03/01/2017

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013

Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)
standard by Association Connecting Electronics Industries, 10/01/2001

TMRC 1999 Market for Flexible Circuits
Report / Survey by Association Connecting Electronics Industries, 06/27/2000

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

Electronic Assembly Evaluation Handbook
standard by Association Connecting Electronics Industries,

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018