Category: IPC

Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992

Technology Reference for Design Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,

TMRC 1999 Market for Flexible Circuits – TMRC99F
Report / Survey by Association Connecting Electronics Industries, 01/01/1999

Polymer Thick Film Artwork
standard by Association Connecting Electronics Industries,

Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 07/01/2015

Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
standard by Association Connecting Electronics Industries, 01/01/2015

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012

Component Mounting Guidelines for Printed Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2004

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003

Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires
standard by Association Connecting Electronics Industries, 10/01/2019