Category: IPC

Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
standard by Association Connecting Electronics Industries, 06/01/2006

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013

Ten-Layer Multi Artwork – D-350 Format
standard by Association Connecting Electronics Industries,

Qualifications and Performance of Polymer Thick Film Printed Boards
standard by Association Connecting Electronics Industries, 01/01/1987

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016

Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014

Solderless Surface Mount Connectors Design Characteristics and Application Guidelines
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2017

Library Format Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 02/01/1987

Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2015

Solderability Tests for Printed Boards with Amendment 1&2
standard by Association Connecting Electronics Industries, 09/01/2017