Category: IPC

Selection and Implementation Strategy for a Low-Residue, No-Clean Process
standard by Association Connecting Electronics Industries, 12/01/1998

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017

Standard for Determining Current Carrying Capacity in Printed Board Design (Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten)
standard by Association Connecting Electronics Industries, 05/01/2010

White Paper on Global Change in Ionic Cleanliness Requirements
standard by Association Connecting Electronics Industries, 10/03/2018

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2015

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 09/01/2017

Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 01/01/2020

Intellectual Property Protection in Electronic Assembly Manufacturing
standard by Association Connecting Electronics Industries, 12/01/2015

TM-650 – Test Methods Manual
standard by Association Connecting Electronics Industries,

Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 03/01/2018

Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999

TMRC Technology Trends for Rigid Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 06/27/2000