Category: IPC

Design Guide for Embedded Passive Device Printed Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 03/01/2007

Ten-Layer Multi Artwork – Gerber Format
standard by Association Connecting Electronics Industries,

Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries, 08/01/2008

Sectional Requirements for Board Fabrication Documentation
standard by Association Connecting Electronics Industries, 03/01/2010

SMT Assembly Benchmark Artwork – Gerber Format
standard by Association Connecting Electronics Industries,

Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
standard by Association Connecting Electronics Industries, 01/01/2018

Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by Association Connecting Electronics Industries, 03/01/2009

Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 08/01/2018

Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 04/01/2016

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012

Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 11/01/2017

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002