Category: IPC

Standards for Surface Mount Assemblies Manual
standard by Association Connecting Electronics Industries,

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2
standard by Association Connecting Electronics Industries, 10/01/2002

Standard for Visual Optical Inspection Aids
standard by Association Connecting Electronics Industries, 10/01/1993

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2004

Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005

Design and Critical Process Requirements for Cable and Wiring Harnesses
standard by Association Connecting Electronics Industries, 12/01/2015

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2005

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013

Implementation of Flip Chip and Chip Scale Technology
standard by Association Connecting Electronics Industries, 01/01/1996

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2014

Bare Board Electrical Test – VIDEO
standard by Association Connecting Electronics Industries, 04/01/1998