Category: IPC
IPC
IPC J-STD-033C-1
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2014
IPC SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
standard by Association Connecting Electronics Industries, 11/01/1992
IPC SM-784
Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990
IPC TR-481
Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981
IPC TA-721
Technology Assessment Handbook on Multilayer Boards
standard by Association Connecting Electronics Industries,
IPC TR-483
Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991