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IEC 62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.
Product Details
- Edition:
- 1.0
- Published:
- 11/07/2018
- Number of Pages:
- 22
- File Size:
- 1 file , 1.4 MB