Click here to purchase
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.
Product Details
- Edition:
- 1.0
- Published:
- 11/28/2018
- Number of Pages:
- 28
- File Size:
- 1 file , 2.5 MB