IPC 6018D

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This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. 

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

Product Details

Published:
02/01/2022
ISBN(s):
9781638160601
Number of Pages:
60
File Size:
1 file , 2.7 MB
Product Code(s):
6018-STD-0-D-0-EN-D
Note:
This product is unavailable in Belarus, Russia, Ukraine