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Single-sided (4 up) pattern used for evaluating interaction of solder flux & solder paste residues on printed boards. The board contains 4 comb patterns with .4 mm lines & .5 mm spaces. (2 pcs 30 x 45 cm 1:1) Film.
AS ASA CISPR NFPA-FLUID NORSOK SMPTE
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Single-sided (4 up) pattern used for evaluating interaction of solder flux & solder paste residues on printed boards. The board contains 4 comb patterns with .4 mm lines & .5 mm spaces. (2 pcs 30 x 45 cm 1:1) Film.
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